Hello.
I have try to immobilize the thoilated aptamer onto the gold surface such as Gold coated silicon wafer and the gold coated screen printed electrode.
However, it is failed, after aptamer treated with TCEP. According to majority of the articles, they has demonstrated that the aptamer reduced by TCEP can be immobilized onto the gold surface efficiency. But in my case, without any TCEP treatment, the aptamer seems possibly adsorbed onto the electrode.
Thus, I would kindly to inquiry whether the TCEP may impact on the Au-S binding process, and what I can do to improve the efficiency of immobilization?
Thank you very much for your support.
Best,
Feixiong
I do use TCEP, and it should reduce your disulfide aptamer to the thiol and bind. If you are getting binding without TCEP I suspect is just non-specific adsorption. I don't check researchgate much you can find me here - https://www.zimmerpeacocktech.com/contact-support/
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