I have been getting a low plasma and no coating while doing rf sputtering of copper doped ZnS using a power of 140 watts and at pressure of 6.5x10-3 Mb.
That can have plenty of reasons. The first thing to check are the electrical contacts, whether those parts that should have a contact do have it and also whether those that shouldn't have no shorts. Otherwise you may have a small plasma somewhere on an edge but not in the dedicated plasma zone. We just had a maintenance training here and even after having used our tool for several years and having troubleshooted multiple problems, we were still surprised how many short/contact positions we didn't know about yet.
Once all of that is clear, you can check your gas inlets for jamming; I expect you already checked your chamber, and particularly your target for contamination, anyway?
With respect,
perhaps this article might be useful to you.
1. Check the magnetron (position of magnets behind the target).
2. Try increasing the working pressure.
you have to calculate the binding energy of your material.
The power must be sufficient to extract atoms from the target
- Badges
- Science method
- Similar topics
- Methodology
- Crystallography
- X-ray Diffraction