I have a spincoated thin film of P(VDF-TrFE). I'd like to attach a thicker, transparent film as a backing layer that would allow me to pull off the PVDF film without it crinkling. I have access to a variety of cleanroom tools and extensive experience in chemistry and surface functionalization.
What are some good candidate backing layers that will tolerate temperatures > 120 C? If functionalization or e-beam evaporation is needed, I prefer to do this to the backing layer, not to the PVDF. I'm currently looking at ways to functionalize PDMS, PET, and PI.
Polyimide is the best in your application. You could benefit from the following link for the processing.
https://matmatch.com/learn/material/polyimide
Thanks Xuhua. I just tried Kapton tape, which is polyimide. I put the spincoated PVDF in contact with the tape, laminated it at 120 C, and the PVDF film was successfully detached. Now I just need to see how strong the adhesion is.
Kapton (polyimide) is effectively the most widely used polymer if you want to use it as a substrate. However if you are looking for an interstitial layer that you can deposit and then peel of, Parylene may be better. It can be deposited by thermal evaporation, resists the temperatures associated with most classical microelectronic processes and will provide a very smooth surface if deposited on glass or Si wafer.
Having little experience in this field I can only think of EVOH as a possible solution - hopefully it triggers others with better ideas.
- Badges
- Science topic
- Similar topics
- Chemistry
- Nanotechnology
- Nanostructures
- Thin Films