hy all,
I am trying to deposit Cu on Al, glass using magnetron sputtering at Rt and RF power 250. But the adhesion of the Cu layer to the Al substrate is very low and peeled off using normal sellotape. How it can be improved ??.
You can one of the following as an adhesion layer,
just 5 nm
Ti , Cr, Ta or MoGe
A buffer layer of Cr or Ti, about 3 nm thick, promotes good adhesion between metals and glass.
thanks a lot Dr. Jose-Miguel Garcia-Martin and Dr. Muhammad Shahbaz Anwar
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