I have seen some systems, such as FEI requires a particular sample preparation (rectangular thin samples with 90 degree edges). Their configurations can only do 3D EBSD on the edge of the rectangular specimens.
It means that we can not do 3D EBSD on the normal 2D EBSD samples (normal mounted samples).
Is this the normal procedure for all the 3D EBSD configurations our in the market? Is there any possibility to run 3D EBSD tests on the normal samples, i.e. not those special rectangular shapes?
Any specific guideline for sample preparation for 3D EBSD analysis, using normal grinding/polishing equipment?
The Zeiss Oxford system for 3D EBSD can perform 3D EBSD on "normal" 2D EBSD samples. It does this using automated stage movements between the FIB mill cycle and EBSD mapping cycle. Tescan also have a solution. It's very much dependent on the SEM model, FIB to SEM geometry, and stage design. The manufactures have PDFs on these sort of workflows on their websites.
Thanks Steven.
I could not find PDFs on manufacturers' website. But I got an email from FEI to prepare samples for demo of their FESEM/FIB system and it was not like "normal" 2D EBSD samples!. It required special sample preparation, not as difficult as TEM sample preparation, but not also not as easy as normal EBSD sample preparation!
Good to know that Zeiss has a solution. Then I suppose Zeiss-EDAX must also be the same. right?
Please see the attachment. it was carried out by Raabe and Zaefferer. You can find important information.
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