Which is more reactive to Cu plate? pH 4 buffer solution or pH 9.2 buffer solution? and Why? How will they effect the Cu plate if I dip it in one of those solutions?
Cu electrodeposition is difficult because usually metallic substrates are attacked by copper during dip that precipitates creating a bad deposit without adhesion. To overcome this problem is important to lower the reduction potential of copper through suited complexing agent. The best agent is ethylendiamine, also ammonia and NTA are good agents. Both work in basic environment at pH 9-10 so in my opinion this is the best PH for electrodeposition. A mixture of NH4Cl and ammonia at pH 10 (buffer) is a good solution for a performing worth deposition (both functional and decorative)
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