This is a too general question and it should be notified what do you mean by measurement?
As for the methods which they utilize to identify and "measure" crystalline characteristics of materials, XRD uses monochromatic X-ray while TEM and SEM use concentrated electron beams. While TEM observes electron diffraction after transmission, SEM uses secondary and back scattered electrons. As a matter of the differences between SEM and "FESEM", the electron source is the only difference while the mechanism of identification is the same between both.
but as a matter of the origin of different methods, one clear difference is that in XRD the specific planes of all grains participate in diffraction. On the other hand in TEM, the planes of only one crystalline grain participate in diffraction. Secondly, there exists a big gap between the ranges of Ewald spheres in XRD and TEM. that's why only a limited number of diffractions occur in XRD while many orders of diffractions can be seen in TEM DP even from a single family of planes.
SEM determines the morphology of the sample. The source of the beam is the excited electrons from the tungsten filament. When the electron beam hits the sample, the interaction of the beam electrons from the filament and the sample atoms generates a variety of signals. Secondary electrons - electrons from the sample itself.Backscattered electrons-beam electrons from the filament that bounce off nuclei of atoms in the sample. The output of the interaction is detected by the backscattered detector. secondary -ray detector.
The SEM scans its electron beam line by line over the sample. It's much like using a flashlight in a dark room to scan the room from side to side. Gradually the image is built on a TV monitor (cathode ray tube