i have prepared nimn thin film. I have used urea and thio urea as an additive. Urea increases the coercivity whereas thio urea decreases it. What is the reason behind it?
Maybe you can try to search for this paper (it was standing directly underneath your question in my RG timeline...)
Effect of additives on electrochemical deposition of nickel nanowires
E Matei, M Enculescu, M Sima, R Neumann, I Enculescu
https://www.researchgate.net/publication/267162150_Interface-spawned_NiSe_quantum_dots_preparation_photoluminescent_properties_and_applications
Article Interface-spawned NiSe quantum dots: Preparation, photolumin...
From structural point of view, they are both very similar to each other, with this difference that in thiourea the oxygen atom is replaced by a sulfur atom, what causes that their properties are significantly different due to the differences in electronegativity between sulfur and oxygen. Thus, the lower Hc observed in the case of thiourea additive is assigned to the presence of sulfur atoms, which inclusions into film reduce its internal stress and what goes after this, the grain size, resulting in lower Hc values. Besides thiourea you can also use saccharin, which is commonly used in the case of Ni, Co and/or Fe -based films.
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