Hi Nadeem,

the chip can be glued to the board using silver epoxy adhesive; this could be done manually, preferably under a microscope, with a "calm" hand and some patience.

In contrast, the electrical connections between the pads on the chip and your microstrips require the use of a bonding machine which fixes thin wires or ribbons by thermo-compression. Apart from the datasheet, please see

http://cdn.macom.com/applicationnotes/m541.pdf

I don't know of any "home-brew" method to do the bonding. So, if there isn't a suitable machine available on your campus you had to find a company which provides bonding as a service. In this case, I would discuss the details of your layout beforehand with this company, and would leave it to them also to do the glueing.

If the diode is supplied with surface mount electrodes, it can be assembled by surface mount assembly technology. If its two electrodes are in the two sides of the diode you can use the methods brought by the colleagues Joerg. Where the lower side will be attached to a boding bad by silver epoxy while the other electrode is connected to a bonding bad by wire bonding. You do not have a bonder you can attach the wires by silver epoxy also.

Best wishes

Joerg Fricke Thank you for your insightful comments. Highly appreciated. Can you please have a look at the following datasheet and comment; either the chip can be glued or it will need bonding. What I understand from your comments, these chips cold be either glues or wire bonded.

https://cdn.macom.com/datasheets/MA4AGSW4.pdf

Prof Abdelhalim abdelnaby Zekry , I am always highly thankful for your expert opinions.

In continuation to this discussion, can you please comment more precisely by looking into the datasheet of this switch that I want to integrate on a microstrip line circuit. Attached is the datasheet please.

https://cdn.macom.com/datasheets/MA4AGSW4.pdf

Nadeem Ashraf In the circuit diagram on page 1 of the datasheet, there are 5 pads J1 to J5 for the signals and 4 GND symbols needed as bias current return paths. The complete bottom of the chip is the GND pad which has to be soldered or glued to a GND pad (of about the same size as the chip) of your PCB. Since

- the manufacturer recommends special solder which might not be easily obtained,

- the GND pad on your PCB will have several vias in order to get a low inductance connection to the GND plane below, and as a consequence will draw off a lot of thermal energy during soldering, and

- the manufacturer restricts the actual soldering process to 10 seconds,

I would prefer glueing, using an electrically well conductive adhesive like this one:

https://www.mouser.de/datasheet/2/265/tds-8331-2parts-1539061.pdf

or (electrically even better) this one:

https://www.mouser.de/datasheet/2/69/Cw2400tds-1224167.pdf

But with suitable equipment (reflow oven), soldering is also possible, of course.

After this first step the chip is mechanically fixed to your board, and is electrically connected to GND.

The drawing on page 5 shows the top of the chip. No dimensons of the (yellow) signal pads J1 to J5 are given but the drawing is probably to scale; so, the pads are squares of about 0.1 mm side length. Each pad has two neighboring structures with vias, and the distance between the pads and their neighbors seems to be less than 0.1 mm; of course, the pads and these neighbors must not be shorted by the bonding process.

While in principle it might be feasable to glue wires to these pads, I would not dare it. In my opinion, bonding as recommended by the manufacturer is the only reliable way.

So, the decision is: soldering or glueing for the GND connection; but the signal connections between J1 .. J5 and the microstrips on your PCB should be bonded in any case.