Dear all,
i am depositing pure Al on a DC Magnetron sputtering tool and I am getting melted targets all the time. The target dimensions are: diameter 50mm and thickness 4mm.
A bit of historical inputs:We were using 100W DC and due to the same effect we decreased to 75W breaking the process in cycles of max 30 minutes dep + 10 minutes pause.
Recently we had the exact same problem. I thinking to reduce even further the deposition power but it has a tremendous impact on the deposition rate.
Is there something that i am not taking in consideration?
Best regards,
José Rodrigues
Jose,
Your target should be able to handle that power level. But there needs to be sufficient cooling water capability. Check your water flow and how good the thermal connection is between the target and the body of the magnetron.
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