We are using AgPd conductor paste 6120 (Dupont) for thick film HMC technology.
Chemical Composition includes Ag, Pd & other materials like -- Platinum, Ruthenium, Glass powder, Resin etc also exists.
1. What is the % of each material?
2. How to evaluate AgPd composition?
3. What should be the ratio of Ag & Pd for thick Film HMC technology? (This is printed on 96% Alumina substrate)
4. Whether Pd content is the most important part?
5. What will happen if Pd content is less?
6. How to evaluate a conductor paste?
7. Whether paste can be Re-validated? If yes, then How long?
8. What is the Re-Validation process for any paste?