We are using AgPd conductor paste 6120 (Dupont) for thick film HMC technology.

Chemical Composition includes Ag, Pd & other materials like -- Platinum, Ruthenium, Glass powder, Resin etc also exists.

1. What is the % of each material?

2. How to evaluate AgPd composition?

3. What should be the ratio of Ag & Pd for thick Film HMC technology? (This is printed on 96% Alumina substrate)

4. Whether Pd content is the most important part?

5. What will happen if Pd content is less?

6. How to evaluate a conductor paste?

7. Whether paste can be Re-validated? If yes, then How long?

8. What is the Re-Validation process for any paste?

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