It was given that, emulsifying the PCM with CuO nanoparticles can result in effective thermal conductivity. The dispersion of the Cu nanoparticles in the base PCM could increase the thermal conductivity and melting rate while they improved the melting/solidification of PCM using radial conductive fins and nanoparticles in the cylindrical annulus. (given in Melting and solidification of PCM enhanced by radial conductive fins and nanoparticles in cylindrical annulus)
The addition of metal-based TCE, even in lower volume fractions (