I am working on cu cu thermo compression bonding. To get good bond strength copper metal should be contamination free and it should not get oxidized. when i am patterening the copper, i am observing the photoresist residues on copper surface. How can i remove these residues and organic contamination on cu metal surface without oxidizing the copper metal.
Can i use oxygen plasma to clean this or it may oxidize the copper metal.?
kindly suggest some suggestions.
Copper is the catalyst for the conversion of ethyl alcohol into acetaldehyde. Plaque into the probe a bit of ethyl alcohol, warm it up. Separately preheat your copper sample in the flame of an alcohol lamp to remove resist and organic matter. Dip copper with a clean surface into a pair of alcohol. Use the sample after heating or reaction. Choose the best. Remember that the sample will still be oxidized. This is thermodynamically advantageous. That this was not your manipulation should be done under argon. Get acquainted with argon welding.
Another possibility would be plasma ashing. You can read here some works about copper micro electrode fabrication and removal of the photoresist AZ and SU-8 (for SU-8 using plasma ashing): Article Electroplated Cu Micro Electrode for the Application in Micr...
Article Applying SU-8 (TM) to the fabrication of micro electro disch...
I guess it depends a bit on the photo resist used, but most will dissolve in sodium hydroxide solution, and either isopropanol or acetone. If potential solvent residue is a serious concern you could remove this with oxygen plasma. There will always be some surface oxidation regardless, but unless you carry out some serious electrochemistry it is unlikely to be a very thick layer.
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