I hope you're all doing well. I am a PhD student at İstanbul University and I study on thin film fabrication and characterizations. I observe all XRD peaks of PZT after I annealed the film although there exist some cracks on the surface. However, whenever I coat top electrode, its short circuit to bottom electrode due to cracks. Before annealing, no XRD peaks are observed.

I am stuck in annealing process of PZT since the surface of thin films cracks. I fabricate thin films via RF magnetron sputter and anneal them 1 hour in a furnace between 400 - 650 ℃ with an increase of 50 ℃. Ramping up is 3 or 6 ℃/min, ramping down is 1 ℃/min or I let the furnace to cool down to room temperature naturally (~10 hours). No gas is introduced into furnace. Could you please help me about annealing process? How do you carry out annealing for PZT? Like in how many hours you reach to 650 ℃ and in how many hours it cools down to room temperature? I can't make PZT film without cracks. I also will try RTA and I need your suggestions for both the furnace and RTA. Thanks in advance. [The surface of the film is attached = PZT(1.3µm)/Pt(100nm)/Ti(10nm)/SiO2(300nm)/Si(350µm)]

More Ahmet Ünverdi's questions See All
Similar questions and discussions