I was wondering how ebeam evaporation and sputtering are different. I understand from deposition point of view like one is conformal (ebeam )and other one is directional (sputtering). But I am not clear which one to choose for what applications. For example if I want to make a contact for I-V measurement of simple oxide thin film which one to choose. It will nice if you share your views and experience.
Mohamed Bahri
Ankur Goswami After 4 years of your post, I'm now asking the same question so if you got some answers thanks for sharing it with us
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