Since I am working with the sputtering approach for the deposition of nanomaterials, I need to know the preparation methods of a sputter compact and extracting it without demolition.
What is the diameter of the target you need, and what is material whose target you wish to fabricate ?
sir, The diameter of the target is 50 mm and it is a complex oxide target (1:1 mole ratio of two oxide powders Lanthanum Oxide and Tungsten oxide
Pressed powders can be compacted by the normal ceramic technology through the sintering step.
You mix the oside powders thoroughly, add 1 to 2% PVA binder, and grannulate the powder mixture. Using a hydraulic press, you press the powder to obtain a green ceramic, and then sinter it an appropriate temperature to obtain a dense ceramic target.
and whatever surface you get should be smooth enough for use as a target. This is what people do for making PLD or sputtering targets.
Why do you need a very highly smooth finished surface.
Because in the process of obtaining a smooth surface, you will have to grind and polish the target using emery papers, or alumina powders, but then such a process can introduce impurities into your target surface, and hence it is not advisable.
Sir, After the process of sintering sometimes I am able to observe very minor cracks over the surface of the targets. Though the cracks are not very large, while loading and unloading the target inside the chamber it may get broken sometimes. This is the reason I am asking for a smooth finished surface.
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