While I am working with RF Sputtering Unit, I am not able to achieve a healthy and dense plasma. Instead, I am ending up with a plasma that is weak and diverging from the placement of the target. I am able to see the target while the plasma is appearing.That is how weak the plasma. The RF power is also not exceeding with 30 watts with null reflected power. If I increase the power more than that, the reflected power is also getting increased. I have also checked for any gas leakages but I cannot find any. What may be the possible reasons for this problem. Give me some solutions.
1. What ever target you are using can be problematic sometimes. There seems to be a serious impedance mismatch problem between your target and rf power supply.
1a. There can be an air gap between your target and electrode.
2. Try putting a simple Copper target of 2 to 3 mm thickness (parallel plate), and see if you are able to get a dense plasma and increase your power beyond 50 W.
3. 50 W is a lot of power on 2 inch target diameter metal target to give a fantastic deposition rate.
Does your system have an automatic capacitance matching system or is that done manually?
In the latter case, every process parameter setting needs its own set of matching capacitances. If it's automatic, check if it is actually doing something.
Then, performing a sweetspot ignition, i.e. stabilize at high gas flows and ramp down to your desired process parameters simultaneously to ramping up your sputtering power.
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