I have prepared Copper thin films by magnetron sputtering and the samples have been annealed at 100, 200 and 300 degree celsius. The variation of the rms roughness and all other AFM height related parameters like roughness exponent, lateral correlation length etc. are similar. They increase first when annealed at 100 degree and then starts decreasing. What can be the reason for such a reversal in behaviour? An adequate explanation or some good references would be really helpful.
Thank you.
Hello,
a possible explanation could be the interplay of grain growth and oxidation of the layers during annealing.
Oxidation might/will! occur also during annealing in vacuum, inert gas (Ar, N2), only annealing in a reducing atmosphere (forming gas: Ar or N2 with some % of H2) will form a thin protective oxide. In contradiction to Cr, Ni, Fe Cu forms poor oxide layers, thicker Cu oxides will tend to be rough.
Attached you'll find some references for the annealing of CuNi layers.
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