You can deposit i.e. Au , Ti on a substrate by Sputtering , Its very easy

dear Tahere Golizadeh ;

there are many purposes for multi layer electrochemical coating like;

Nickel (Ni)/ Copper (Cu) multilayer electroplating dual coating technique.which is used to increase the surface hardness of the coated Cu substrate compared to the pure Cu substrate.

or silver on zinc oxide coating.which can be used in the solar cell industry for coating layers of P and N, types to acts as a diode allows electrons movement from N to P, when photons with sufficient energy hit the cell.

also it can be used in manufacturing semiconductors, batteries and data storage.

Dear Tahere;

This is a very general question. In my opinion, you should first determine the area of evaluation. Each action can take various effect on your single deposited film. For example, sometimes the corrosion resistivity of the coated layer is improved, while adhesion and mechanical properties of the finished surface are not satisfying enough. From my experience, it will have good resistivity to corrosion, and the barrier effect of your film will be enhanced due to the increase in the thickness of the deposited layer. What is important is that you have to take care of cracks, and superficial tensions over the preparing step. Such multilayer depositions are used in many applications with electrical, and protective purposes.