Previously, we used to get a thick metal plate (similar purity as the sputter target) and wire cut it make as circular target of 50 mm dia. In this way, one gets 4 sputter targets with the same money. Is there any difference in the quality of the films? Did anyone used both types of targets and tried? is there any effect on the performance of the process?
I expect not effects on the film quality if the purity and the kind of impurities are the same.
Actually, we use gold coins (e.g. Krüegerrand) instead of commercially available gold sputter targets for creating gold metal contacts, during my time in a sience lab. The price factor was > 2.
I personally used both types of targets with the same purity and the quality of the film was so good in sputtering no doubt.
Some cases the thickness of the sputtering target plays a role, it might affect the sputtering yield.
Before removing the shutter just above the substrate, pre-sputtering is recommonded for at least 2 hrs at low plasma current which will clean the target surface impurity if any and after stablisation, remove the shutter and deposit the films of good quality.
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