Hello.
I want to make an pattern on the ITO glass.
I attached a picture of my experiment process and results.
A problem occurred in the process of PhotoResist development.
When I spray AZ300 MIF develper on coated PhotoResist, all PR comes off.
I've tried both spraying and dipping method, and I've tried both on Si wafer and slide glass also.
But results were same.
Why are these problems?
Adhesion issues are most commonly caused by high humidity (in extreme cases water vapor may even condense due to evaporative cooling of the wafer) or contamination of spin bowl. What PR are you using? By the appearance, I guess that it's some kind of positive diazo naphthoquinone resist. Have you considered priming your samples with HMDS (hexamethyldisilazane) to improve adhesion?
Are you experiencing the same issues with different photoresists? Maybe the PR container was contaminated? For example, there could some water vapor condensation if the container was stored in the refrigerator and opened before reaching room temperature.
The possible reasons for dissolving the complete PR during/after development can be:
1. The exposure is not enough. Increase the exposure dose.
2. Developer solution is very concentrated. You can dilute the developer solution by adding the suitable additive i.e DI water and develop the sample.
I hope this will help you.
Thanks,
Varun
I would wait more time for dehydratation before spin coating the photoresist, at least 10 min at 200ºC, and would perform a plasma cleaner process before spin coating the resist. This way you can assume that no water is present in the surface and adhesion will be guarantee.
Also lowering the temperature in baking processes (95 ºC) and increase then the time could help, (also a ramp of temperature can be a good option. First in a hot plate at 65 ºC and then at 95ºC). This way you can reduce photoresists stresses during baking times.
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