Hi,
I am planning to spin coating some photoresist on trenches surface(~1um in depth, 300-1000nm in width). I am wondering will the PR has same thickness on the top surface and the bottom valley? Is there any way to do the surface planarization? For now, I have photoresist Microposit S1800 G2 series or SPR220-7.
Thanks in advance!
You can always test your current resist and see what happens - spin coat it with the PR that you have, bake, and then perform heat measurements with a tool such as a Dektak. If it does not meet your standards, wash it off with acetone. I would assume that a resist that is thicker than your trench depth would do the trick. Remember that the thickness will depend on the resist type, the spinning RPM, and the length of spinning.
Dear Chengzhi.
Please answer these 10 questions so that I may be of help
1. What is your substrate, Silicon or?
2. Size of the filed, 4, 5 or 6 inch?
3. Is this a silicon wafer, is it a round wafer?
4. Yes, SPR-220-7 is good and will cover the trenches you specified. Spin coat at 3000 or 3500 RPM, the allow the substrate to stay at room temp for about 20-25 must to make sure trenches are completely covered.
5. What are pre-treating the substrates? HMDS or?
6. What is your Soft bake temp and leant of time? Consult with the data shed on the photoresists please.
7. Exposure light wavelength, is it broad band or ?
8. Develop? Make sure you test run on less critical wafers and theN : examine each site from edge to center for 5-01 are to make sure you have FULLY developed
9. TMAH develop?
10. What is the step after developing the substrate?
GOD-WILLLING
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