If direct spin coating can result in thick and wide range of edge beads, how can processing or other spin coating methods be used to avoid the appearance of large range of edge beads?
This page can be helpfull:
https://www.ossila.com/pages/spin-coating
Hey Ou Zhang one thing I used to do it attach my sample to a wafer. You can do this by using a little bit of photoresist on the bottom of you sample then plop that on the center of a wafer and bake. Alternatively a method that works surprisingly well is to use a drop of water on the bottom of your sample and the put that on a wafer. These methods have worked well for me when my sample was Si or glass.
Good luck!
Adam Weidling Thank you very much for your answer. Could you please explain in more detail? Does the process you mentioned include spin coating? I didn't quite understand what you said about using photoresist at the bottom of the sample. How can you ensure that the spin coating process does not come off?
Ou Zhang I would normally just take a small drop of PR then put my sample on top and bake it. ive never had issues of it coming off During spinning. The only time it would come off is during development if youre doing litho. But even this can be overcome by playing with different PRs and the chemistries .
Adam Weidling Very thanks you again.Sorry, I still don't quite understand what you said. My sample is 3 × three × I want to evenly apply PMMA photoresist onto a 1mm small piece through spin coating. I still don't quite understand the method you mentioned. Could you please draw a schematic diagram? Also, I don't quite understand the method you mentioned for water droplets.
The reduction of this can be achieved by controlling certain parameters, such as increasing the spin speed and time or decreasing the solution density.
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