As we know that RF power have demonstrate its great advantage on film properties with magnetron sputter. But, this technique had been applied only to planar targets.
Known advantages of rotary cylindrical target compared to planar targets,so it's attractive to expand the use of RF power to rotary cylindrical target . But I haven't seen any equipment combinations like that, neither any research literatures on that. I want to know why? what will happen if i deposit thin films (such as ITO film) with RF power rotaty cylindrical target?
I have never seen a rotation of the target itself, but e.g. an ARQ81 sputtering source contains a rotation of the magnet system behind the target. You can DM me if you need more info.
While RF power has demonstrated advantages for magnetron sputtering of thin films using planar targets, the use of RF power with rotary cylindrical targets is not as common. This may be due to technical challenges in designing and operating the equipment for this type of configuration.
In a rotary cylindrical target configuration, the target rotates and the substrate is located in close proximity to the target, allowing for high deposition rates and potentially better film properties. However, there are technical challenges associated with maintaining a stable plasma and uniform deposition over the entire surface of the substrate in this type of configuration. This is because the geometry of the cylindrical target can lead to uneven deposition and varying plasma conditions, which can affect the film properties.
That being said, there have been some studies that have explored the use of rotary cylindrical targets for thin film deposition, including for ITO films. In one study, the authors used a DC pulsed magnetron sputtering system with a cylindrical ITO target and found that the ITO films deposited using this configuration exhibited good electrical and optical properties. However, the authors noted that achieving uniform deposition over large areas remained a challenge.
If you were to attempt to deposit thin films, such as ITO films, using RF power and a rotary cylindrical target, it is possible that you may encounter similar challenges with achieving uniform deposition and maintaining stable plasma conditions. However, the exact outcome will depend on the specific equipment and parameters used, and there may be ways to optimize the deposition conditions to achieve better results. It's worth noting that there may be other deposition techniques that are better suited for depositing ITO films, such as electron beam evaporation or pulsed laser deposition, which are more commonly used for this type of material.
Why not rotate the substrate? Here is an example. I have had good results doing it this way and its less complicated.
- Badges
- Science topic
- Similar topics
- Engineering
- Materials Engineering
- Coating