28 February 2018 4 785 Report

Hello, everyone!

I want to reduce the thickness of copper foil (from 15um to 3um) by electrochemical etching (CuSO4 as electrolyte, lead and copper foil as electrode material). The edge of copper foil is fixed on a substrate by waterproof tape, which also ensures one-side etching. However, when the thickness has not been reduced to the value we want, copper foil falls off from the substrate as the copper next to the tape vanishes in etching. That is to say the etching rate at the boundary of copper foil and tape is much faster than other areas. What is the reason for that? How to achieve uniform etching?

Thanks a lot!

Best Regards,

GAO Yang

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