if we are using a substrate for holding the CNTs during upward sputtering since CNTs are in powder form, which Substrate can be used without affecting the purity of CNTs and how to separate metal decorated CNTs from substrate in powder form without affecting the decorated metal nanoparticles?
Dear Hari U a
Decorating carbon nanotubes (CNTs) with metal nanoparticles using upward sputtering is a common method for creating functionalized CNTs with unique properties. The process involves depositing metal nanoparticles on the surface of the CNTs, which can be accomplished by sputtering metal atoms onto the CNTs using a plasma source.
To begin, the CNTs need to be prepared for the deposition process. The CNTs should be of high purity and in powder form. The powder should be dispersed in a solvent, which can help to disperse the CNTs and provide a uniform surface for the deposition process.
When using a substrate to hold the CNTs during the upward sputtering process, it is important to choose a substrate that will not affect the purity of the CNTs. A substrate made of a material that is chemically inert, such as quartz or silicon dioxide, can be used. These substrates will not react with the CNTs or the metal nanoparticles during the deposition process, ensuring that the purity of the CNTs is maintained.
After the upward sputtering process is complete, the metal decorated CNTs can be removed from the substrate. To do this, the CNTs can be gently agitated in a solution that will not dissolve the metal nanoparticles, such as water or ethanol. The solution can then be centrifuged to separate the CNTs from any remaining substrate material. This process should be repeated several times to ensure that all of the metal decorated CNTs are separated from the substrate. Finally, the CNTs can be dried and collected in powder form for further use.
The process of decorating carbon nanotubes (CNTs) with metal nanoparticles using upward sputtering typically involves the following steps:
As for the choice of substrate, it is important to select a material that is compatible with the sputtering process and does not introduce any impurities or contaminants into the sample.
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