Hi,

I am trying to adopt an anisotropic silicon etch recipe to Oxford NGP80 RIE machine. The Original recipe has been optimised for a different machine (NEXTRAL 330 RIE parallel plate plasma reactor with 31 cm electrode). The original recipe uses RF power ~ 300W with getting a self bias of ~150V for certain gas flow and combination. Keeping the pressure and gas flow same how can I translate RF power with a machine (Oxford RIE) that has an electrode of 24 cm? Is there any model/equation that roughly gives the relation between RF power, self-bias and electrode size?

Thanks in advance.

Regards,

Salahuddin

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