We are struggling to have a big problem about E-beam source contamination by E-beam shutter.
Some materials(for instance Ta2O5, Al2O3, Si) deposited on the e-beam shutter is very often dropped the others e-beam source.
So it happen big problem of wrong film property by e-beam evaporated.
We are using Al2O3, Si, SiO2, Ta2O5 e-beam source with Ion beam assisted Ar, O2, N2 gas.
Jürgen Weippert
What timescale are we talking about here?
Parts of deposition machines need to be sandblasted from time to time and some materials are incompatible in this context, so that would be normal.
If that already happens after a week, that's of course a bit often.
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