Have anyone used or seen any tech with microstrip or signal line submerged in the ceramic substrate, resulting in a smooth surface above?
I am trying to find an approach to thermal solution through the signal line. Ideally, I would see a 0.07mm (2 oz) copper line submerged into AlN, or SiC substrate. These materials have superb thermal conductivity. AlN can even be flexible, while SiC has very small thermal expansion; making both very sustainable against thermal destruction.
There are many questions, like matching with the copper expansion, or using low-expansion traces... but the main question, is there such tech? can it be ordered?
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