I deposit Mo thin film of about 1 micron thick on SLG substrate using DC magnetron sputtering. whe i use it to clean in DI water or acetone or alcohol it etches out. What is the main reason behind it and how to resolve this issue.
One of the reason may be bad step coverage and non-homogeneity of films. Kindly check the target substrate angle and distance.
Usually substrate temperature raising is used to improve adhesion. surface roughness also play significance role. I think, generally, low adhesion in your case related to low zeta potential between them. If interstitial layer is not recommended or desired you can use high substrate temp.
Molybdenum very easily solves in peroxide solutions. If you create some reaction between water and the SLG/Mo substrate that forms active oxygen radicals your Mo will dissolve. If there is residual stress in the Mo/SLG substrate from the sputtering process this process of dissolving will be enhanced. It could just be films stress which is killing you since Mo is known for its residual film stress. If the film stress is < 1 GPa you should be ok.
Hi Gautam,
During the sputtering higher value of work pressure will help to increase the roughness of o film so it might help you to increase film adhesion. I hope it might help you.
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