20 November 2023 3 9K Report

"Understanding Electroplating Bubbling Phenomena in Nickel-Boron (NiB) Solution with Copper Cathode and Nickel Anode"

I am conducting an electroplating experiment where nickel (anode) is being plated onto a copper cathode in a nickel boron (NiB) solution as the electrolyte. Upon initiating the circuit, I observe bubbling occurring at both the anode and cathode. I am seeking a comprehensive explanation for the bubbling phenomenon and the underlying chemical reactions taking place during the electroplating process. Can someone provide insights into the factors contributing to the observed bubbling and the specific reactions involved at the anode and cathode interfaces in this nickel-boron electroplating setup? Additionally, any relevant literature or references on this topic would be greatly appreciated.

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