Hello,everyone !Recently I am working on AAO preparation for copper nanowire fabrication, and I would like to do anodization under room temperature and then do barrier layer thinning to provide better contact for copper deposition ,however, the surface of AAO corrode randomly with no reason after 30min of one step anodization,but I saw many paper that there was no problem that doing anodization even above room temperature,could you recommend me some advices? thanks!

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