Which method is suitable for titanium nitride coating? Why is Ti2N formed in titanium nitride coating? What is the effect of Ti2N on bond strength of coat?
Apart from nitriding, PVD (physical vapor deposition) process is also used in order to obtain TiN, TiCN and TiAlN thin layers as hard coatings for machining tools. Surface prepareation and interface bonding layer may be necessary, depending on the base material. Formation of Ti2N usually happens in this kind of deposition due to process conditions and proportion of reagents, according to
Ti + N2= TiN + 0.5N2
2Ti + N2= 2TiN
3Ti + N2= Ti2N + TiN
4Ti + N2= Ti2N + TiN + Ti
These kinds of coatings are generally multilayer, with TiN, Ti2N and Ti, to reach desired properties.
TiN coating can be deposited relatively at low temperature in the physical deposition (PVD) process as compared to chemical vapour deposition (CVD) process.
One of the techniques is pulsed DC closed field unbalanced magnetron reactive sputtering technique. Here are a few examples.
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Titanium nitride is a refractory compound with high microhardness and chemical and thermal stability. TiN has a variety of applications: as a component in special refractories and cermets, as a material for crucibles for anoxic casting of metals, and as a precursor for wear–resistant and decorative “gold-like” coating. iN-based layers are applied by means of a PVD process on CoCr or Ti alloy, each company using its own proprietary procedure.
Techniques such as Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) and Plasma Assisted Chemical Vapor Deposition (PACVD) are usually applied in order to deposit the titanium nitride. However, each of these methods might have some problems. Plasma nitriding method may be introduced as a novel approach for deposition of nano sized titanium nitride. TiN coating can be deposited relatively at low temperature in the physical deposition (PVD) process as compared to chemical vapor deposition (CVD) process. One of the techniques is pulsed DC closed field unbalanced magnetron reactive sputtering technique. Titanium Nitride is a bright gold ceramic coating applied to metallic surfaces by the physical vapor deposition (PVD) process at a work piece temperature of below 500oC. PVD is generally considered the best comparative techniques among mentioned above.