I am looking at performing SiO2 etching off of silicon. My substrates have a Bi4Ti3O12 thin films on them which I wish to avoid damaging, so I intend to cover them in HF etching resist.
I have heard Photoresist can be used, but I am currently lookin into easier and more afforable methods. Could anyone recommend an alternative material, thats easy to apply, remove, and won't effect the surface of my material.
Many Thanks
Daivd Coathup
Hello David,
You haven't really provided enough details. How thick is the SiO2 layer that you wish to etch? What are the dimensions of the features?
Hopefully with a few more details there may be some suitable answers.
Kind regards,
Jules
On a side note, always a good guide for etchants/masks:
ftp://doc.nit.ac.ir/cee/baganji/Theory%20and%20Technology/Kirt%20Etch%20Rates%20%20Part%20II.pdf
Dear Jules,
The SiO2 is a by product of annealing my films at 700OC in ambient atmosphere for 1 hour. I am trying to calculate the exact thickness, but I expect it to be extremely thin.
Best wishes
David.
If your films are very thin you can use photoresist (which is >= 1 micrometer thick) to protect the Bi4Ti3O12 films during HF etching. I think it is the easiest method.
Use Buffered HF (BHF, mix of NH4F and HF) instead of HF. And, from a microfab. point of view, resist is the easiest way to do that. If you want to use another material, you will have to do a lithography anyway so..... You can use protect resist or litho resist, BHF pH is weak so, both resist is ok.
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