I have a Si/SiO2 substrate with pre-deposited Gold contacts, and i wish to clean it before I start depositing my organic layers for my OFET fabrication.
Any Idea on the best method to do this without damaging the substrate or the contacts?
I suppose that you previously cleaned the substrate before deposit the gold contacts, and to do this you surely used a mask resist before evaporating the gold for your contacts.
So, you should use the corresponding recommended solvent for your resist. Then, if you consider that your substrate requires still a deep cleaning, you may use some of the steps of the Standard RCA cleaning process, particularly the first step used to strip the organics. Probably some of the following steps of the RCA procedure could be too agressive for you gold contacts (perhaps SC1 and/or SC2), and you should skip it.
In any case, these kind of cleaning procedures are in the literature, and I recommend, as a first step, to read the book: Silicon VLSI Technology, J.D. Plummer, M.D. Deal, P.B. Griffin, Prentice Hall (2000).