Dear all,
i understand that some papers use multilayers for electrodes to enhance the contact resistivity, but is this the only reason?
and how does one decide the suitable material and thickness to use for multilayer electrodes?
Their selection depends on the particular application and substrate, the Cr layer in Cr/Au is generally used to improve adhesion of the metal layer to silicon/silicon oxide. Ti/Au is also a common combination when using Si/SiO2 and platinum/Au might be used for the same reason for the same or another substrate.
For material selection, in addition to contact resistivity, also consider the adhesion of the metal(s) and their coefficient(s) of thermal expansion. Thickness depends on the particular application, but generally, the adhesion layer (Cr) is just thick enough such that it is pinhole free and the subsequent metal layer's thickness is determined based on the desired resistivity and the application/constraints
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