The difference between Chemical Vapour Deposition (CVD) and Physical Vapour Deposition (PVD) is the chemical reaction at the substrate surface in CVD.
PVD instead uses a vapour which can condense at substrate surface. No reaction takes place.
Typical PVD methods are sputtering deposition, pulsed laser deposition, molecular beam epitaxy,...
Typical CVD methods are metalorganic chemical vapour deposition (MOCVD), plasma-enhanced chemical vapor deposition (PECVD),....
The difference between Chemical Vapour Deposition (CVD) and Physical Vapour Deposition (PVD) is the chemical reaction at the substrate surface in CVD.
PVD instead uses a vapour which can condense at substrate surface. No reaction takes place.
Typical PVD methods are sputtering deposition, pulsed laser deposition, molecular beam epitaxy,...
Typical CVD methods are metalorganic chemical vapour deposition (MOCVD), plasma-enhanced chemical vapor deposition (PECVD),....
In addition to the previous answer, usually CVD could be done at lower temperatures than PVD. Also PVD is a line-of-sight process, while CVD is not.
Sorry...it is a coating process where only the surface in the direct view is coated (90 degrees +/- 5). It is the case of thermal spray processes where guns are used, or in the case of PVD where the condensed vapor is focalised on the surface. Thus internal diameters, corners and any other hard-to-reach surfaces remain uncoated. Hope it is clear
Physical vapour deposition techniques particularly thermal evaporation techniqus have fractionation effect, i.e., the composition of the alloy or compound may not remain same. CVD processes are relatively better for getting required concentration of constituent elements. However, if film of single element is required, PVD techniques can safely be used and are relatively easy as compared to CVD techniques.
Dear Michael and Dr A. Kumar and Nihad ,
in The physical vapor deposition, which one of deposition methods is line of sight?
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