Dear Researchers,
What are the simple and low cost techniques available to bond copper wire on a glass substrate? The important thing is the adhesion strength of the bonded sample should survive at 200-250 degC. Thank you
IMHO, here are no simple and low cost solutions if you require a reliable and robust solder joint to withstand the temperatures you require. The standard process would be evaporation of Cu metal onto the hot substrate in vacuum to provide a thin film suitable for soldering.
You may find useful the signalled papers: L. J. Buttolph, "Silica to glass and to metal joints", J. Opt. Soc. Am., 11(5) 1925, 549-557; E. C. McKelvy, C.S. Taylor, "Glass to metal joints", J. Am. Chem. Soc., 42(7), 1920, 1364-1374.
Vivekananthan,
Typically Cu wire, few microns thick are bonded ultrasonically. You will need a metalization layer on top of the glass substrate to do that. The attached chart can be used as a guidance to choose the right material for metalization. Cu wire on Cu pad would be a good choice as you can avoid issues due to IMC, which will definitely be a concern at temperature conditions you have mentioned. Al is a popular choice and if you are considering this, I would suggest you to look at the attached articles to identify factors that affect bond strength and improve interfacial adhesion.
Good Luck,
Subramani
You can bond metal wires on bond pads. You can form pads by joining glass strips to the glass by silver epoxy. Then you can dry the silver epoxy in a furnace at 90 degree centigrade. You can even dry it under strong lamp or in the room temperature for about one day.
Then you deposit tin on the cupper. The pads will be ready to solder wires on it or to bond wires.
This may be a simple way to connect wires to Glass.
Best wishes
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