Dear Zadid Shifat,

You may want to look over the following sources:

Simcenter: Siemens Simulation Software

Using Simcenter simulation software opens the door to an unrivaled wealth of engineering expertise. Our engineering technology solutions are backed by a global team of engineering specialists, dedicated to helping you meet the challenges of your industry and exceed the expectations of your market.

https://www.plm.automation.siemens.com/global/en/webinar/simcenter-engineering-technology-speeds-product-development-and-testing/87293?utm_campaign=2022-3-global-tac_025_012_gbl_od_simulation_driven_design_for_design_engineers&utm_source=google&utm_medium=cpc&_ref=dXRtX2NhbXBhaWduPTIwMjItMy1nbG9iYWwtdGFjXzAyNV8wMTJfZ2JsX29kX3NpbXVsYXRpb25fZHJpdmVuX2Rlc2lnbl9mb3JfZGVzaWduX2VuZ2luZWVycyZ1dG1fc291cmNlPWdvb2dsZSZ1dG1fbWVkaXVtPWNwYw%3D%3D

Dear Zadid Shifat,

See some auxiliary data below:

VSim Is Your Multiphysics Simulation Software For Complex Problems

PreviousNextVSim is the Multiphysics Simulation Software used by design engineers and research scientists who require precise solutions for challenging problems.

VSim’s unique combination of Finite-Difference Time-Domain (FDTD), Particle-in-Cell (PIC), and Charged Fluid (Finite Volume) methods deliver accurate results for a variety of situations.As a parallel software application, VSim can efficiently handle problems at scale, and simulations run quickly using algorithms designed for high-performance computing systems. Trusted by researchers in 30 countries, and used by engineers in industries from aerospace to semiconductor manufacturing, VSim is the ideal multiphysics simulation tool.

https://txcorp.com/vsim/?gclid=CjwKCAjwgr6TBhAGEiwA3aVuId_CpHPcCiJPxtkLcI4s4rvfMqMPNlqMB_YW_id9_Fa3W4IUbz6oGBoCK7wQAvD_BwE

Dear Zadid,

Try check this link:

https://crosslight.com/wp-content/uploads/2013/11/procom_info.pdf

Hope this useful.

Thanks Len Leonid Mizrah . Could you please let me know if any software(s) are usable for simulating etching characteristics?

Thanks Alina a Rahman Othman for the feedback.