As far as I know, there are three popular methods of etching in ceramic engineering, which are: thermal, chemical and plasma etching. We usually use these technique to etch the grain boundary on the surface of a ceramic, so that we can observe those grain boundary more easily. What are the differences between them? I am interested in not only the physical mechanism, but also the practical applications, advantages and disadvantages of these methods.
Hi Son Thanh,
you should read the following article that is very interesting. You will find the comparison between several technics of ceramic etching (chemical, plasma, laser, water jet,...), pros & cons; the reference is :
"Review of micromachining of ceramics by etching"; Trans. Nonferrous Met. Sic. China 19(2009) s1-s16; written by H.T.Ting & al.
Nevertheless, there is no data about thermal etching, but you shoul find this in another one.
Regards
Mohamed
Thank you very much, Mohamed Boufnichel. A very great and informative article!
Regards,
Son
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