The silicon wafer is adsorbed on the platform(fig 1), and an obvious V-shaped depression appears like fig 2.
The flatness of the silicon wafer itself does not exceed 2um, and the flatness of the platform does not exceed 5um.
The thickness of the silicon wafer is L 40mm，W 28mm, H=1.0mm. The platform is basically the same size. How to overcome the obvious deformation?
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