I use a DISCO DAD323 dicing machine to cut my sample,which has 1-2 micrometers SIO2 on its top.However,the SIO2 is broken and fall apart everytime.I tried different cutting speed but didn't work. Is this because of too much stress during silicon oxide deposition?Should I change my dicing blade?(I am using hard dicing blade ZH05)

Thanks for your time.

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