"Quantifying Bubble Generation in Electroplating: Nickel-Boron (NiB) Solution with Copper Cathode and Nickel Anode"

In my electroplating experiment involving the deposition of nickel onto a copper cathode in a nickel boron (NiB) solution with a nickel anode, I have observed bubbling at both the anode and cathode upon initiating the circuit. I am interested in quantifying the number of bubbles generated during the electroplating process as a means of understanding and optimizing the system. What methods or techniques can be employed to approximate the number of bubbles produced? Are there specific instruments or analytical approaches that researchers commonly use for this purpose? Additionally, any recommendations for relevant literature or studies on quantifying bubble generation in electroplating would be highly valuable.