I've created a simple cantilever MEMS structure with very thin aluminum contact pads. Through the release process of the MEMS structure, the contact pads have become damaged and therefore do not bond with wirebonds. Are there any options i have to re-deposit more metal (increase the thickness) on the metal contact pads, without affecting the rest of the structure?
i have few chips that have already been released and few chips that havent been released yet.
help is appreciated! thank you.
Dear Kissan,
What are the size of the pads? If the pads are relatively large you can support the them by silver epoxy where you can supply them by a silver spot by a fine injector.
You can cover the whole device by adhesive tape except the pads and then support by electroplating silver on it.
Best wishes
@Kissan Mistry,
Aluminium is very difficult to do wirebonding. Why not use gold contact to bond a gold wire. As far as i know we use gold contacts bonded eith gold wires for MEMs which work well.
silicon and aluminium are the best for mems.
Two step DWP(dissolved wafer process) can be used for lapsing and other by which surface roughness can be increased.
Thickness can also be increased with out distrubing the metal layers.
lapping polishing is the best for it.
one of my paper document please refer.
Depends highly on the size of the pads. Mostly shadow mask should work if you have the design files.
hello Shankar Dutta and Anuj Singhal thank you for your responses. The current pad sizes on the device are 100x100um, which i now know was a very poor design choice. Do you know if it is possible to create a shadow mask with this feature size?
100×100 um a bit difficult...but if you have access to DRIE then you can create through hole of this size and use it a shadow masking layer...
Seconding to Dr. Dutta's answer, you can also use a laser marker if you have one. I did use a thin aluminum sheet for this purpose and it worked. Depends on laser marker though.
Depends highly on the size of the pads. Mostly shadow mask should work if you have the design files.
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