Hi Arun, I would have thought such a simulation would be extremely complicated, having to take into effect, chemical species in the vacuum, the 3D magnetic field strength of the magnetron, shielding by the target, different sputtering material yields, andode and cathode geometry etc. etc. RF sputtering in practice can be extremely challenging on lab scale and somewhat of a black art, as you have to contend with many changing parameters, one of the most significant is poisoning and build up of material on the target itself. For very large scale applications it might be more meaningful where you have very static operating conditions over long periods of time.