You can try to deposit material on PET, for example see the following paper link: http://pubs.rsc.org/-/content/articlepdf/2017/ta/c6ta10997g
or electrospinning/electroplating approach please see: Article Ni-core CuO-shell Fibers Produced by Electrospinning and Ele...
It will be much better if you could elaborate more on some specific material you are interested and which techniques are possible (available) for you. May be some modified approach with your available technique could be suggest by the forum members. You can also explore more of the work like Huang et al. in the attached file.
Flexible substrate: It can be a thin metallic foil, plastic sheet or a silicon membrane.
Of all the these substrate, I would thin the best choice for a flexible substrate is a micromachined passivated silicon membrane. Because you can firstly process the piezoelectric layer, and then micromachine from bottom, and obtain a flexible membrane substrate. This method allows you to deposit piezoelectric layers like (PZT and Aluminum nitride) which are normally deposited at a high enough temperature.
Alternately thin metal foils and plastic sheets are not suitable to deposit piezo layers, which usually demand a high processing temperature.
There is only piezoelectric material ZnO which can be sputtered without any heating, and this can be deposited onto thin metallic foils comfortably, and also on metallized plastic sheets. But its piezo coupling coefficient is low.
Finally a PVDF-TrFe is an excellent choice, because it can be easily metallised, and used straightaway for some kind of device application.
PET or Si-rubber can be used as substrate followed by deposition of bottom electrode (Bottom side of Piezoelectric generator) on top of the substrate, then Piezoelectric material can be transferred on the substrate. Afterwards, the top electrode can be formed. Moreover, you may check my paper
Article A scalable, flexible and transparent GaN based heterojunctio...