The diameter of holes are in the range of 80-400 um, since these holes are laser drilled, only a sectioned profile can give clear insight about hole profile,amount of re solidification etc. My sample is TIAl6V4
Dear colleague! It seems to me that is a perfect "job" for scanning confocal optical microscopy. There are a lot of systems commercially available, e. g. Nanofocus, Olympus, Veeco-Bruker etc. The only question is that the aspect ratio, i. e. the depth of your holes should be too large, i. e. much larger than the diameter. Wkr, M. Herms.
Thanks Dr. Herms, the expected depth ranges from few hundred microns to 1 mm is it a acceptable range for confocal microscopy?
I dont know which is the geometry of test samples, but possibly you can use tangential grinding to expose the inside of the holes. However, when more little the diameter, more difficult to make this task.
For me is very, very important to use the same clamping device where you put the sample to make the laser holes, and after to grinding the sample.
In this way you can maintain the alignment of the sample.
For sectioning of 200-400 um holes, go for WEDM (with 150 -200 um wire dia) and machine the half portion to get the another half. But still Mounting of the sample and machining quality (surface integrity) are critical issues.
Im agree with wire edm, but I think that grinding is better because you can make the exposure of the hole process in progresively manner. In the case of wire edm, this possibility dont exist.
Dear colleague, confocal optical microscopy works well on structures of depth of several microns. If the aspect ratio is too large, i. e. depth > diameter, you see no reflection from the bottom part of hole. Perhaps, some parts of hole are more V-shaped? Can you measure the sample face-up and face-down? Can you tilt the sample?n... the best way is testing it :) M. H.
What about using a "non-invasive" method trying a replica / moulding method - then analyzing the "negative" and / or viewing by SEM? Best of luck W.M.
One possible option is creating a negative with two component mold (e.g. available from Haereus Kulzer: Provil novo or similar). Is has quiet a good resolution in the region less than 0,5µm. It is flexible and should be able to be pulled out of the most holes. Then of course measure the negative, e.g. with laser scanning confocal microscopy from the side view. Suggestion is not to look at just one sample per parameter to be sure you do not measure an artefact of preparation.
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