A Thin film sticking well onto a substrate with good adhesion is naturally clamped.
There is no way how we can reduce it, and identify with a measurable parameter, the amount of clamping.
Maybe use thermal evaporation instead of high energy E-beam or sputtering.
One other way is to use thermal expansion mismatched (non reactive or alloying) substrates, and grown a thick film, it will get de-laminated (if lucky). I could easily de laminate Cu films deposited by sputtering.
It al depends which thin film material you are referring to in your question, and on which substrate.
Thank you Prof. K. Sreenivas for the answer given to me.
Actually I am working in magnetoelectric composites. In such type of composites, the strain transfer in form of thin film from one layer to another layer should go as it is i.e. without diminishing the strain.
But the clamping effect of substrate generally reduces the strain.
So I asked about the possible way out.
Hi Sougata.
Not all thin films have compressive stresses. There are thin coatings that have tensile stresses (for example, films containing alkali metals). I don't know what coatings you are using but in terms of internal stresses, stress compensation is possible.
I hope this information was useful to you.
Generally, any adhesion bwt two materials is often goven with the Rate of Deposition-speed.
Inview of the alignment of every atom that would require 'Time-domain' to pack before second layer of atom deposited..
Therefore, in order to achieve an optimal condition, do consider the speed of deposition would be established through either by choice of Method or Re-Ergrg application of parameters.
Wish you good luck on your works.
One can develop stress free piezoelectric ZnO films, by carefully controlling the sputtering deposition parameters, and it will be useful to study on different substrates which are suitable for magnetoelectric effects.
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