I have multiple thin layers on my substrate and I want to use HMDS to improve the surface tension before using photoresist.
The issue is that the developer solution will remove it and for the next step I still need it on the surface... is there a way to keep it?
Is it a good idea to apply it again via spin coating after the photoresist development stage? (gas phase requires high temperature that will damage the lithography structure).
Not really. HMDS could be decomposed to some degree by residual humidity present inside the PR and on the wafer surface. Additionally, it is a pretty good solvent - it may cause leaching of PR components. Both hydrolysis and leaching can contaminate exposed areas of your wafer. You can vapor prime it at a lower temperature.
we do not use HMDS priming when spincoating a second resit layer on the first photoresist. In order to improve adhesion, you may use a light oxygen plasma etching at low temperture and power.
Cheers
Alvise
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