Hello all,
I have a problem depositing a thin SiO2 film by PECVD onto a Au substrate. The adhesion between SiO2 and Au is poor and I could not deposit Au and then SiO2 using the same equipment under vacuum. I am wondering if there is a way for me to improve the adhesion. Would a Cr layer between Au and SiO2 work (I could deposit Au and Cr with the same equipment)? Thank you very much!