29 November 2016 6 1K Report

Hello all, 

I have a problem depositing a thin SiO2 film by PECVD onto a Au substrate. The  adhesion between SiO2 and Au is poor and I could not deposit Au and then SiO2 using the same equipment under vacuum. I am wondering if there is a way for me to improve the adhesion. Would a Cr layer between Au and SiO2 work (I could deposit Au and Cr with the same equipment)? Thank you very much!

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